Wet Cleaning Equipment

Abstract

With semiconductor manufacturing development, it is necessary to perform a damage-free process to remove particles, native oxide layer, metal contamination, organic, sacrificial layer, and other residuals from the wafer surface. For the metal line interconnect, the copper metal layer is deposited by electrochemical plating on the seed layer. The metal layer and the oxide layer need to be planarized by chemical-mechanical polish. All these processes could be summarized as the wet process, which is based on liquid state deionizedWater (DIW) or chemistries with some physical auxiliary mechanism to react on the wafer surface. This chapter presents an overview for semiconductor industry wet process tools, processes, and applications, including the following: single-wafer-type scrubber, single-With semiconductor manufacturing development, it is necessary to perform a damage-free process to remove particles, native oxide layer, metal contamination, organic, sacrificial layer, and other residuals from the wafer surface. For the metal line interconnect, the copper metal layer is deposited by electrochemical plating on the seed layer. The metal layer and the oxide layer need to be planarized by chemical-mechanical polish. All these processes could be summarized as the wet process, which is based on liquid state deionizedWater (DIW) or chemistries with some physical auxiliary mechanism to react on the wafer surface. This chapter presents an overview for semiconductor industry wet process tools, processes, and applications, including the following: single-wafer-type scrubber, single-wafer wet etch, single-bath wafer cleaner, cryogenic-aerosol wafer cleaner, chemical mechanical polisher, stress-free polish equipment, and copper electrochemical plating equipment.