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Development of a Dry-contact Ultrasonic Technique and Its Application to NDE of IC Packages

  • Tohmyoh H
  • Saka M
Kluwer Academic Publishers, (2006), 443-454
DOI: 10.1007/0-306-48410-2_42
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Tohmyoh, H., & Saka, M. (2006). Development of a Dry-contact Ultrasonic Technique and Its Application to NDE of IC Packages. In Recent Advances in Experimental Mechanics (pp. 443–454). Kluwer Academic Publishers. https://doi.org/10.1007/0-306-48410-2_42

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