Pin defect inspection with X-ray images

0Citations
Citations of this article
2Readers
Mendeley users who have this article in their library.
Get full text

Abstract

A method of Printed Circuit Board (PCB) pin defect inspection is proposed in this paper. First, we input the pin location image. Then, we align images with Circle Hough Transform (CHT) [4]. Finally, we train cascade classifier with adaptive boosting [3] and Local Binary Pattern (LBP) [5], and detect pin defect to reduce false alarm rate and miss detection rate and thus enhance pin production yield rate.

Cite

CITATION STYLE

APA

Kao, H. P., Tung, T. C., Chen, H. Y., Wong, C. S., & Fuh, C. S. (2017). Pin defect inspection with X-ray images. In Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics) (Vol. 10262 LNCS, pp. 465–473). Springer Verlag. https://doi.org/10.1007/978-3-319-59081-3_54

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free