A method of Printed Circuit Board (PCB) pin defect inspection is proposed in this paper. First, we input the pin location image. Then, we align images with Circle Hough Transform (CHT) [4]. Finally, we train cascade classifier with adaptive boosting [3] and Local Binary Pattern (LBP) [5], and detect pin defect to reduce false alarm rate and miss detection rate and thus enhance pin production yield rate.
CITATION STYLE
Kao, H. P., Tung, T. C., Chen, H. Y., Wong, C. S., & Fuh, C. S. (2017). Pin defect inspection with X-ray images. In Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics) (Vol. 10262 LNCS, pp. 465–473). Springer Verlag. https://doi.org/10.1007/978-3-319-59081-3_54
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