Standardization of Integrated Circuits Packaging

Abstract

Packaging standards define the requirements of structure, material, surface coating, external checking, and testing of product reliability, etc. This chapter describes the standardization of IC packaging, including the introduction of international packaging standardization organizations, such as International Electro-technical Commission (IEC), Semiconductor Equipment and Materials International (SEMI), Joint Electronic Device Engineering Council (JEDEC) Standards, and Association Connecting Electronics Industries (IPC) Standards. In addition, China packaging standardization organizations, the description of standardization of package outlines and package naming, National Standard for Integrated Circuit Packaging (GJB), US Military (MIL) standards, and Automotive Electronics Council (AEC)-Q100 Standards are also discussed.