Three dimensional thermal modeling of laser diode stack

Abstract

The aim of the study is to analyze the influence of heat load and structural parameters on junction temperature, temperature profiling and thermal resistance of laser diode stack. To know optimal structural parameters and temperature profiling, three dimensional steady and transient state thermal modeling of laser diode stack using Comsol software is carried out. The effect of pulse duration, heat load, submount height and thickness variation were studied to know the distribution of temperature along the whole structure of laser diode stack. Modeling study make it possible to design and select out the optimal values of structural parameters corresponding to the minimum thermal resistance of the structure. Results showed that the most important parameter of whole structure is thickness of CuW submount.