Abstract
We present the first integrated piezoresistive microsensor capableof measuring in-situ, simultaneously forces in all three axes duringultrasound wire bonding. Its bandwidth reaches from low-frequencyforces as the bonding force up to the ultrasound stress generatedby the transducer system. The microsensor was optimized to the requirementsof wire bonding to achieve high measurement repeatability, noiseand temperature insensitivity. (4 References)
Cite
CITATION STYLE
Schwizer, J., Mayer, M., Brand, O., & Baltes, H. (2001). Analysis of Ultrasonic Wire Bonding by In-situ Piezoresistive Microsensors. In Transducers ’01 Eurosensors XV (pp. 1398–1401). Springer Berlin Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_330
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